 |
|
|
|
|
|
 |
|
|
|
|
|
 |
|
 |
 |
 |
|
 |
|
|
|
 |
|
Please note that the prices above reflect the PM price.
March 16-18, 2010 Shanghai, China  March 21-25, 2010 San Diego, CA San Diego Convention Center Booth #1340  June 8-10, 2010 Nuremberg, Germany Hall 9, Booth 432
|
|

Coining manufactures solder preforms and brazing preforms used for joining applications in microelectronics packaging and assembly.
We are the largest solder preform manufacturer in the world, as measured by both sales volume and units shipped. Coining has the most extensive library of solder preform dies in the industry, with about 15,000 different tools on the shelf, ready to make your parts.
Coining also is a leading producer of gold, aluminum and copper bonding wire as well as jumper chips, bonding pads, tabs, heat sinks, lead frames, solder spheres and cover assemblies for the microelectronics industry. Our small Kovar™, molybdenum, copper, tungsten and clad stamped parts, often packaged in tape and reel configuration or in waffle packs, are used by many customers throughout the world.
Need a quote? Contact Coining here.
We operate from facilities in Saddle Brook, NJ; Armonk, NY; Penang, Malaysia; and Casablanca, Morocco, serving 800+ customers in more than twenty-five countries around the world since 1965.
Our customers enjoy exceptionally fast lead-times, reliable on-time deliveries, right-the-first-time-and-every-time quality and outstanding customer service on solder preforms and other wire and stamped products, from quotation request until order fulfillment.
We recently completed the acquisition of SPM. Click here to read the news release about this acquisition.
Learn more about our products: Preforms Spheres Microstampings Cover Assemblies Wire and Ribbon
|
|
|
Company | Capabilities | Products | Contact | Site Map
© 2010 Coining, Inc. All rights reserved |